Invention Grant
- Patent Title: Electronic devices with embedded die interconnect structures, and methods of manufacture thereof
- Patent Title (中): 具有嵌入式芯片互连结构的电子设备及其制造方法
-
Application No.: US13688820Application Date: 2012-11-29
-
Publication No.: US09401338B2Publication Date: 2016-07-26
- Inventor: Alan J. Magnus , Francisco Chaidez
- Applicant: Alan J. Magnus , Francisco Chaidez
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Agent Sherry W. Schumm
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L25/065 ; H01L25/03 ; H01L25/00 ; H01L21/56 ; H01L23/538 ; H01L25/18
Abstract:
An embodiment of an electronic device includes an IC die with a top surface and a bond pad exposed at the top surface. A stud bump (or stack of stud bumps) is connected to the bond pad, and the stud bump and die are encapsulated with encapsulant. A trench is formed from a top surface of the encapsulant to the stud bump, resulting in the formation of a trench-oriented surface of the stud bump, which is exposed at the bottom of the trench. An end of an interconnect is connected to the trench-oriented surface of the stud bump. The interconnect extends above the encapsulant top surface, and may be coupled to another IC die of the same electronic device, another IC die that is distinct from the device, or another conductive feature of the device or a larger electronic system in which the device is incorporated.
Public/Granted literature
- US20140145325A1 ELECTRONIC DEVICES WITH EMBEDDED DIE INTERCONNECT STRUCTURES, AND METHODS OF MANUFACTURE THEREOF Public/Granted day:2014-05-29
Information query
IPC分类:
