An integrated interposer includes an interposer substrate including at least a first portion of a 3D passive device within an active region of the interposer substrate. The integrated interposer also includes an inter-conductive dielectric layer on an active surface of the active region of the interposer substrate, the inter-conductive dielectric layer including at least a second portion of the 3D passive device. The integrated interposer further includes a contact layer coupled to the 3D passive devices and configured to couple at least one die to the integrated interposer. The integrated interposer also includes at least one through via coupled to the contact layer and extending through the interposer substrate to a passive surface of the interposer substrate. The integrated interposer further includes an interconnect layer on the passive surface of the interposer substrate and coupled to the at least one through via.