Invention Grant
- Patent Title: Semiconductor light-receiving element and method for manufacturing same
- Patent Title (中): 半导体光接收元件及其制造方法
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Application No.: US14885056Application Date: 2015-10-16
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Publication No.: US09401447B2Publication Date: 2016-07-26
- Inventor: Shigekazu Okumura
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Main IPC: H01L31/102
- IPC: H01L31/102 ; H01L31/105 ; G02B6/122 ; H01L31/0232 ; H01L31/028 ; H01L31/0352 ; H01L31/109 ; H01L31/18 ; H04J14/02

Abstract:
The present invention pertains to a semiconductor light-receiving element and a method for manufacturing the same, enabling operation in a wide wavelength bandwidth and achieving fast response and high response efficiency. A PIN type photodiode made by sequentially layering on top of the substrate a Si layer of a first conductivity type, a non-doped Ge layer and a Ge layer of a second conductivity type that is the opposite type of the first conductivity type and a Ge current-blocking mechanism is provided in at least part of the periphery of the PIN type photodiode.
Public/Granted literature
- US20160043262A1 SEMICONDUCTOR LIGHT-RECEIVING ELEMENT AND METHOD FOR MANUFACTURING SAME Public/Granted day:2016-02-11
Information query
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