Invention Grant
- Patent Title: Optoelectronic package and method of manufacturing the same
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Application No.: US14731395Application Date: 2015-06-04
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Publication No.: US09401463B2Publication Date: 2016-07-26
- Inventor: En-Min Jow , Chi-Jang Lo , Nan-Chun Lin Lin , Shang Yu Chang Chien
- Applicant: APTOS TECHNOLOGY INC.
- Main IPC: H01L29/18
- IPC: H01L29/18 ; H01L33/54 ; H01L33/56 ; H01L27/146 ; H01L23/00 ; H01L27/15 ; H01L33/48
Abstract:
An optoelectronic package includes an optoelectronic chip, a transparent protection layer and a plurality of pads. The optoelectronic chip has an upper surface and an active area defined on the upper surface. The transparent protection layer is connected to the optoelectronic chip and covers the upper surface. The transparent protection layer touches and is entirely attached to the active area. The pads are electrically connected to the optoelectronic chip.
Public/Granted literature
- US20150270457A1 OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-09-24
Information query
IPC分类:
