Invention Grant
- Patent Title: High-frequency signal line and electronic device including the same
- Patent Title (中): 高频信号线和电子设备包括相同
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Application No.: US14191605Application Date: 2014-02-27
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Publication No.: US09401532B2Publication Date: 2016-07-26
- Inventor: Shigeru Tago , Satoshi Sasaki , Noboru Kato
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-246380 20111110; JP2012-018230 20120131
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H05K1/02 ; H05K1/14 ; H05K3/46 ; H01P5/02

Abstract:
A high-frequency signal line includes a dielectric element body including regions and a plurality of flexible dielectric sheets. A signal conductive layer is provided in or on the dielectric element body. Ground conductive layers are provided in or on the dielectric element body and face the signal conductive layer. A distance between the ground conductive layer and the signal conductive layer in the region is smaller than a distance between the ground conductive layer and the signal conductive layer in the regions. The dielectric element body is bent in the region.
Public/Granted literature
- US20140176264A1 HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2014-06-26
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