Invention Grant
- Patent Title: High-frequency signal line and electronic device
- Patent Title (中): 高频信号线和电子设备
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Application No.: US14193106Application Date: 2014-02-28
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Publication No.: US09401534B2Publication Date: 2016-07-26
- Inventor: Noboru Kato , Shigeru Tago
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-281384 20111222
- Main IPC: H01P3/08
- IPC: H01P3/08

Abstract:
A high-frequency signal line includes an element assembly including a plurality of flexible insulator layers, a linear signal line provided in or on the element assembly, a first ground conductor arranged in or on the element assembly so as to be opposed to the signal line not in a first section including a portion of the signal line but in a second section adjacent to the first section, and a second ground conductor provided along the signal line in the first section on the insulator layer on which the signal line is provided. The second ground conductor is not opposed at least in part to the first ground conductor in the first section.
Public/Granted literature
- US20140176266A1 HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE Public/Granted day:2014-06-26
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