Invention Grant
- Patent Title: Structurally integrated antenna aperture electronics attachment design
- Patent Title (中): 结构集成天线孔电子附件设计
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Application No.: US14154139Application Date: 2014-01-13
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Publication No.: US09401538B2Publication Date: 2016-07-26
- Inventor: Manny S. Urcia , Joseph A. Marshall , Douglas A. McCarville , Otis F. Layton , Adrian Viisoreanu
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: McDonnell Boehnen Hulbert and Berghoff LLP
- Main IPC: H01S4/00
- IPC: H01S4/00 ; H01Q1/12 ; H01Q9/16 ; H01Q1/28 ; H01Q9/28 ; H01Q13/08 ; H01Q21/00

Abstract:
An antenna electronics attachment system is disclosed. The antenna electronics attachment system includes a structural honeycomb panel having an array of cells. The antenna electronics attachment system further includes a nutplate coupled to a mounting plate via a plurality of embedded fastening structures. The mounting plate is shaped to fit substantially precisely to a cell of the structural honeycomb panel. The antenna electronics attachment system also includes an electronic component coupled to the nutplate. And, the antenna electronics attachment system further includes mechanical-electronic coupling means operable for change-out while in-service of the electronic component.
Public/Granted literature
- US20140320366A1 STRUCTURALLY INTEGRATED ANTENNA APERTURE ELECTRONICS ATTACHMENT DESIGN AND METHODOLOGY Public/Granted day:2014-10-30
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