Invention Grant
- Patent Title: Method of curing a coating agent on a crimp terminal
- Patent Title (中): 在压接端子上固化涂层剂的方法
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Application No.: US13500791Application Date: 2010-12-09
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Publication No.: US09401549B2Publication Date: 2016-07-26
- Inventor: Hideto Kumakura , Yuichi Ito , Nobuyuki Asakura
- Applicant: Hideto Kumakura , Yuichi Ito , Nobuyuki Asakura
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-279691 20091209
- International Application: PCT/JP2010/072601 WO 20101209
- International Announcement: WO2011/071188 WO 20110616
- Main IPC: H01R43/04
- IPC: H01R43/04 ; H01R4/18 ; H01R4/04 ; H01R13/52

Abstract:
A wire-equipped crimp terminal includes a wire, a crimp terminal and a coating agent. The wire has a conductor exposed from an insulative sheath. The crimp terminal has a crimping piece which is press-deformed to embrace the conductor. The coating agent is coated to a first part of the crimp terminal. A recess is formed at a non-coating part of the crimp terminal where the coating agent is not coated. The coating agent is cured by irradiating light or an electron beam to the first part in a state where a part of the coating agent flowing out from the first part is received in the recess.
Public/Granted literature
- US20120214360A1 Wire-Equipped Crimp Terminal and Method of Curing Coating Agent Public/Granted day:2012-08-23
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