Invention Grant
- Patent Title: Connector device
- Patent Title (中): 连接器装置
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Application No.: US14824674Application Date: 2015-08-12
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Publication No.: US09401553B2Publication Date: 2016-07-26
- Inventor: Keiji Hamada
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Banner & Witcoff, Ltd.
- Priority: JP2013-025744 20130213
- Main IPC: H01R13/658
- IPC: H01R13/658 ; H01R12/70 ; H01R13/6592 ; H01R13/502 ; H01R13/6582 ; H01R12/59 ; H01R12/67 ; H01R12/79 ; H01R13/58
Abstract:
A connector device includes an electric wire side connector to which a shielded electric wire is connected, and a board side connector that is connected to a circuit board. The electric wire side connector is engaged with the board side connector. The electric wire side connector includes an electric wire side housing and an electric wire clamping member. The board side connector includes a board side housing and a fixing metal fitting. A bus bar plate electrically contacts the fixing metal fittings when the board side connector is engaged with the electric wire side connector.
Public/Granted literature
- US20150349443A1 Connector Device Public/Granted day:2015-12-03
Information query
