Invention Grant
- Patent Title: Methods and apparatus for terminating wire wound electronic components to a header assembly
- Patent Title (中): 将绕线电子元件端接到头部组件的方法和装置
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Application No.: US14203374Application Date: 2014-03-10
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Publication No.: US09401561B2Publication Date: 2016-07-26
- Inventor: Hengshan Zhou , Yonggang Wang
- Applicant: Pulse Electronics, Inc.
- Applicant Address: US CA San Diego
- Assignee: Pulse Electronics, Inc.
- Current Assignee: Pulse Electronics, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Gazdzinski & Associates, PC
- Main IPC: H01R13/66
- IPC: H01R13/66 ; H01R13/518 ; H01R13/6464 ; H01R13/7193 ; H04Q1/02 ; H01R24/64

Abstract:
An exemplary header insert assembly, and methods of manufacture and use thereof. In one embodiment, the header insert assembly comprises a connector insert assembly having an insert body assembly consisting of an insert body element. The insert body element includes an electronic component receiving cavity that is configured to receive any number of electronic components. The insert body assembly also includes a wire termination feature that includes termination slots that position the wire ends of the wire wound electronic components adjacent to a substrate to which the wire ends are ultimately to be secured. The wire ends are then secured to the substrate using, for example, a mass termination technique. The aforementioned header insert assembly can then be optionally inserted into a single or multi-port connector assembly. Methods of manufacturing the aforementioned single or multi-port connector assemblies are also disclosed.
Public/Granted literature
- US20150011131A1 METHODS AND APPARATUS FOR TERMINATING WIRE WOUND ELECTRONIC COMPONENTS TO A HEADER ASSEMBLY Public/Granted day:2015-01-08
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