Invention Grant
- Patent Title: Method of assembling a transducer assembly
- Patent Title (中): 组装换能器组件的方法
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Application No.: US14284621Application Date: 2014-05-22
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Publication No.: US09401575B2Publication Date: 2016-07-26
- Inventor: Jozef Johannes Gerardus Bosch
- Applicant: Sonion Nederland BV
- Applicant Address: NL Hoofddorp
- Assignee: Sonion Nederland BV
- Current Assignee: Sonion Nederland BV
- Current Assignee Address: NL Hoofddorp
- Agency: Nixon Peabody LLP
- Priority: DK201370292 20130529
- Main IPC: H01R4/02
- IPC: H01R4/02 ; H01R43/00 ; H05K3/34 ; H05K1/11 ; H05K1/18 ; H05K3/32 ; H05K3/30

Abstract:
A method of assembling a transducer assembly comprising a transducer and a conductor element, where one of the transducer and the conductor element includes holes and conducting parts, each conducting part being exposed in or at a hole and the other of the transducer and the conductor element includes elevated, electrically conducting elements. The method includes aligning the conductor element and the transducer so that each of the elevated elements extends into a separate hole of the holes and fixing the transducer to the conductor element by fixing each elevated element to the conducting parts of the pertaining hole.
Public/Granted literature
- US20140353031A1 METHOD OF ASSEMBLING A TRANSDUCER ASSEMBLY Public/Granted day:2014-12-04
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