Invention Grant
- Patent Title: Materials for electroadhesion and electrolaminates
- Patent Title (中): 电粘结和电镀层材料
-
Application No.: US13635889Application Date: 2011-03-18
-
Publication No.: US09401668B2Publication Date: 2016-07-26
- Inventor: Harsha Prahlad , Ronald E. Pelrine , Annjoe Wong-Foy , Roy D. Kornbluh , Brian K. McCoy
- Applicant: Harsha Prahlad , Ronald E. Pelrine , Annjoe Wong-Foy , Roy D. Kornbluh , Brian K. McCoy
- Applicant Address: US CA Menlo Park
- Assignee: SRI International
- Current Assignee: SRI International
- Current Assignee Address: US CA Menlo Park
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- International Application: PCT/US2011/029101 WO 20110318
- International Announcement: WO2011/116357 WO 20110922
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01T23/00 ; H02N13/00

Abstract:
An electroadhesive device includes an outer surface adapted to interface with a surface of a foreign substrate, a plurality of electrodes, and a semi-conductive insulation material disposed adjacent to at least one of the electrodes. Each electrode has a respective conductive volume and is configured to apply a voltage at a respective location of the outer surface, and the difference in voltage between applied voltages includes an electrostatic adhesion voltage that produces an electrostatic force between the device and the substrate that is suitable to maintain a current position of the device relative to the substrate. The insulation material can be polyurethane or any other suitable material having a resistance of about 109 to 1012 ohms*m. The insulation material effectively operates to expand the conductive volume of the electrodes when they are actuated.
Public/Granted literature
- US20130010398A1 Materials for Electroadhesion and Electrolaminates Public/Granted day:2013-01-10
Information query
IPC分类: