Invention Grant
- Patent Title: Electronic device enclosure
- Patent Title (中): 电子设备外壳
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Application No.: US14339718Application Date: 2014-07-24
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Publication No.: US09401733B2Publication Date: 2016-07-26
- Inventor: Shang Tsai Wu
- Applicant: DINKLE ENTERPRISE CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: DINKLE ENTERPRISE CO., LTD.
- Current Assignee: DINKLE ENTERPRISE CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H04B1/38 ; H04B1/3888

Abstract:
An electronic device enclosure which includes a front surface, a back surface opposite to the front surface, and a lateral edge connected with the front surface, wherein a part of the front surface is sloped towards the back surface to define a slope area that extends to the lateral edge, wherein the electronic device enclosure is provided with at least one attachment located in the slope area and at least one connecting port located away from the slope area, whereby the use of the enclosure can be effectively achieved.
Public/Granted literature
- US20160029501A1 ELECTRONIC DEVICE ENCLOSURE Public/Granted day:2016-01-28
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