Invention Grant
- Patent Title: Earphone with passive radiator
- Patent Title (中): 带无源散热器的耳机
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Application No.: US14255527Application Date: 2014-04-17
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Publication No.: US09402126B2Publication Date: 2016-07-26
- Inventor: Ruei-Ting Yeh
- Applicant: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
- Applicant Address: CN
- Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
- Current Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
- Current Assignee Address: CN
- Agency: Bacon & Thomas, PLLC
- Main IPC: H04R1/20
- IPC: H04R1/20 ; H04R1/10 ; H04R1/28

Abstract:
An earphone includes a housing having a sound-emitting hole, a speaker mounted in the housing, and a passive radiator mounted in between the sound hole and the speaker driver and including a vibrating diaphragm main body and a weight embedded in the vibrating diaphragm main body or bonded to the top or bottom surface of the vibrating diaphragm main body. The mounting arrangement of the passive radiator optimizes the sound performance of the earphone. The weight of the passive radiator is firmly connected with the vibrating diaphragm main body so that severe vibration of the vibrating diaphragm main body does not cause disconnection of the weight.
Public/Granted literature
- US20150304760A1 EARPHONE WITH PASSIVE RADIATOR Public/Granted day:2015-10-22
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