Invention Grant
- Patent Title: Earphone
- Patent Title (中): 耳机
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Application No.: US13932980Application Date: 2013-07-01
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Publication No.: US09402127B2Publication Date: 2016-07-26
- Inventor: Yang Wei , Shou-Shan Fan
- Applicant: Tsinghua University , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Beijing TW New Taipei
- Assignee: Tsinghua University,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: Tsinghua University,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Beijing TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: CN2012104710640 20121120
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R25/00 ; H04R23/00

Abstract:
An earphone includes a shell and a thermoacoustic chip. The shell defines a first space. The thermoacoustic chip is disposed in the space of the shell. The thermoacoustic chip includes a speaker and a capsule defining a second space to accommodate the speaker. The speaker includes a substrate, a sound wave generator, a first electrode and a second electrode. The first electrode and the second electrode are spaced from each other and electrically connected to the sound wave generator. The substrate includes a first surface and a second surface opposite to the first surface. The capsule has at least one through hole and at least two connectors. The sound wave generator is opposite to the at least one through hole. Two of the at least two connectors are electrically connected with the first electrode and the second electrode.
Public/Granted literature
- US20140140529A1 EARPHONE Public/Granted day:2014-05-22
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