There is provided a printed circuit substrate and a noise suppression structure capable of minimizing constraint on a component layout on a substrate and suppressing noise. The printed circuit substrate includes conductive patterns of odd numbered layers and conductive patterns of even numbered layers which are alternately arranged in a vertical direction and hold an insulating layer between each layer. Portions excepting predetermined areas for connecting a first through-hole and predetermined areas for insulating from a second through-hole in the conductive patterns of the odd numbered layers have a same shape as portions excepting predetermined areas for connecting the second through-hole and predetermined areas for insulating the first through-hole in the conductive patterns of the even numbered layers, and the portions are laminated on one another at the same position in the vertical direction.