Invention Grant
- Patent Title: Rigid-flexible substrate and method for manufacturing the same
- Patent Title (中): 刚性柔性基材及其制造方法
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Application No.: US14055109Application Date: 2013-10-16
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Publication No.: US09402307B2Publication Date: 2016-07-26
- Inventor: Yoshihito Otsubo , Takayoshi Yoshikawa , Akinori Takezawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-098246 20110426
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K3/46

Abstract:
A rigid-flexible substrate includes a plurality of rigid portions, and a flexible portion connecting the plurality of rigid portions and including a portion of a first resin sheet including at least one layer of a thermoplastic resin sheet, the rigid portions including a portion of the first resin sheet other than the flexible portion, and a second resin sheet including a plurality of thermoplastic resin sheets laminated on one surface or both surfaces of the portion of the first resin sheet other than the flexible portion, and a tapered portion is provided at an end edge of the second resin sheet on a side close to the flexible portion, and a thickness of the tapered portion in a direction in which the second resin sheet is laminated decreases toward the flexible portion and is substantially 0 at a position in contact with the flexible portion.
Public/Granted literature
- US20140034366A1 RIGID-FLEXIBLE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2014-02-06
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