Invention Grant
- Patent Title: Semiconductor package having magnetic connection member
- Patent Title (中): 具有磁性连接构件的半导体封装
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Application No.: US14457493Application Date: 2014-08-12
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Publication No.: US09402315B2Publication Date: 2016-07-26
- Inventor: Hyunsuk Chun , Soojae Park , Seungbae Lee , Sangsu Ha
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2013-0129374 20131029
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/11 ; H01L23/522 ; H01L25/065 ; H01L23/00 ; H01L25/10 ; H01L25/00

Abstract:
Provided is a semiconductor package including a wiring substrate having top and bottom surfaces. A first semiconductor chip is disposed on the wiring substrate in a flip-chip manner. The first semiconductor chip has a first surface facing the top surface of the wiring substrate and a second surface opposite to the first surface. First connection members are disposed between the wiring substrate and the first semiconductor chip. The first connection members include first and second contact members each including one or more magnetic materials. The first contact members include portions disposed in the second contact members. The one or more magnetic material of the first contact members have an opposite polar orientation to that of the second contact members.
Public/Granted literature
- US20150115468A1 SEMICONDUCTOR PACKAGE HAVING MAGNETIC CONNECTION MEMBER Public/Granted day:2015-04-30
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