Invention Grant
- Patent Title: Endoscope circuit board assembly
- Patent Title (中): 内窥镜电路板组装
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Application No.: US13413059Application Date: 2012-03-06
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Publication No.: US09402533B2Publication Date: 2016-08-02
- Inventor: Yaniv Kirma , Moshe Levi , Leonid Krivopisk , Avi Levy
- Applicant: Yaniv Kirma , Moshe Levi , Leonid Krivopisk , Avi Levy
- Applicant Address: IL Caesarea
- Assignee: ENDOCHOICE INNOVATION CENTER LTD.
- Current Assignee: ENDOCHOICE INNOVATION CENTER LTD.
- Current Assignee Address: IL Caesarea
- Agency: Novel IP
- Main IPC: A61B1/04
- IPC: A61B1/04 ; A61B1/06 ; A61B1/00 ; A61B1/05

Abstract:
There is provided herein a circuit board assembly for a tip section of a multi-camera endoscope comprising a camera circuit board configured to carry at least one front-pointing camera and at least one side-pointing camera, a flexible illuminator circuit board comprising at least one foldable panel and configured to carry at least one front illuminator for essentially illuminating the field of view (FOV) of the front-pointing camera and at least one side illuminator for essentially illuminating the FOV of the side-pointing camera.
Public/Granted literature
- US20120229615A1 ENDOSCOPE CIRCUIT BOARD ASSEMBLY Public/Granted day:2012-09-13
Information query