Invention Grant
- Patent Title: Interspinous spacer assembly
- Patent Title (中): 椎间间盘组装
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Application No.: US13058553Application Date: 2009-08-13
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Publication No.: US09402655B2Publication Date: 2016-08-02
- Inventor: Stefan Saladin , Felix Aschmann , Manuel Schaer , Justin Coppes , Nicholas Angert , Grant Skidmore , Michael Mayer
- Applicant: Stefan Saladin , Felix Aschmann , Manuel Schaer , Justin Coppes , Nicholas Angert , Grant Skidmore , Michael Mayer
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, Inc.
- Current Assignee: DePuy Synthes Products, Inc.
- Current Assignee Address: US MA Raynham
- Agency: Meunier Carlin & Curfman LLC
- International Application: PCT/US2009/053727 WO 20090813
- International Announcement: WO2010/019783 WO 20100218
- Main IPC: A61B17/70
- IPC: A61B17/70 ; A61B17/02 ; A61B17/86

Abstract:
An interspinous spacer assembly (100) for insertion and/or implantation between spinous processes of adjacent superior and inferior vertebrae includes an interspinous spacer member (110) sized and configured for insertion into the interspinous space located between adjacent spinous processes and an engagement mechanism (105) for operatively coupling the spacer member to the adjacent spinous processes and for preventing migration of the assembly once implanted. The interspinous spacer assembly is adjustable to conform to the individual anatomy of a patient's spine.
Public/Granted literature
- US20110144692A1 INTERSPINOUS SPACER ASSEMBLY Public/Granted day:2011-06-16
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