Invention Grant
- Patent Title: Collagen gel for bonding porous collagen-based materials with non-porous collagen-based materials
- Patent Title (中): 用多孔胶原基材料粘合多孔胶原基材料的胶原凝胶
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Application No.: US13582795Application Date: 2011-03-07
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Publication No.: US09402709B2Publication Date: 2016-08-02
- Inventor: Simon Kew , Tim Mead , Neil Rushton
- Applicant: Simon Kew , Tim Mead , Neil Rushton
- Applicant Address: GB Cambridge
- Assignee: Tigenix Limited
- Current Assignee: Tigenix Limited
- Current Assignee Address: GB Cambridge
- Agency: Harness, Dickey & Pierce, PLC
- Priority: GB1003656.4 20100305
- International Application: PCT/GB2011/050439 WO 20110307
- International Announcement: WO2011/107807 WO 20110909
- Main IPC: A61L15/32
- IPC: A61L15/32 ; A61L31/12 ; A61F2/02 ; A61L31/04 ; A61L27/24 ; A61L27/26 ; A61L27/46 ; A61L27/52 ; C09J189/06 ; A61F13/00

Abstract:
The invention discloses a process for fabricating a biomaterial, comprising: a) joining a porous collagen based-material with a non-porous collagen based-material by applying a controlled amount of a bonding layer of a gel comprising collagen to a bonding surface of the non-porous collagen based-material, and contacting a surface of the porous collagen based-material with the gel applied to the bonding surface to partially hydrate a section of the porous material at the interface between the materials; b) drying the gel to dry to bond the materials together; and c) cross-linking the collagens in the bonding layer. Also disclosed are biomaterials and implants produced using the fabrication process.
Public/Granted literature
- US20130197662A1 COLLAGEN GEL FOR BONDING POROUS COLLAGEN-BASED MATERIALS WITH NON-POROUS COLLAGEN-BASED MATERIALS Public/Granted day:2013-08-01
Information query
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