Invention Grant
- Patent Title: Zero-profile interbody spacer and coupled plate assembly
- Patent Title (中): 零剖面体间隔板和联接板组件
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Application No.: US13901002Application Date: 2013-05-23
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Publication No.: US09402735B2Publication Date: 2016-08-02
- Inventor: William P. McDonough , William L. Strausbaugh , Christopher Bonner , Thomas Pepe , Ralph Meili , Markus Hunziker , Michael Jeger , Thomas Kueenzi , David Koch , Rainer Ponzer , Joern Richter , Roger Berger
- Applicant: DePuy Synthes Products, Inc.
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, Inc.
- Current Assignee: DePuy Synthes Products, Inc.
- Current Assignee Address: US MA Raynham
- Agency: Baker & Hostetler LLP
- Main IPC: A61B17/88
- IPC: A61B17/88 ; A61F2/46 ; A61F2/44 ; A61B17/80 ; A61B17/17 ; A61B17/86 ; A61F2/30
Abstract:
An implant for insertion into the disc space between vertebrae. The implant including a spacer portion, a plate portion coupled to the spacer portion, a plurality of bone fixation elements for engaging the vertebrae and a retention mechanism for preventing the bone fixation elements from postoperatively uncoupling from the implant.
Public/Granted literature
- US20130268008A1 Zero-Profile Interbody Spacer and Coupled Plate Assembly Public/Granted day:2013-10-10
Information query
