Invention Grant
- Patent Title: Method for forming an abrasive lapping plate
- Patent Title (中): 形成磨料研磨盘的方法
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Application No.: US13929436Application Date: 2013-06-27
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Publication No.: US09403258B2Publication Date: 2016-08-02
- Inventor: Raymond Leroy Moudry , Mihaela Ruxandra Baurceanu , Joel William Hoehn
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee Address: US CA Cupertino
- Agency: HolzerIPLaw, PC
- Main IPC: B24D11/00
- IPC: B24D11/00 ; B24B37/12
Abstract:
A method of forming a lapping plate. The method includes providing a lapping plate having a surface, spraying an adhesive onto the surface, spraying a slurry of abrasive particles and solvent onto the adhesive, and curing the adhesive to form an abrasive coating on the lapping plate. The adhesive may be, for example, epoxy, and the abrasive particles may be, for example, diamonds.
Public/Granted literature
- US20150000202A1 METHOD FOR FORMING AN ABRASIVE LAPPING PLATE Public/Granted day:2015-01-01
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