Invention Grant
- Patent Title: Embedded optics in modular assemblies
- Patent Title (中): 模块化组件中的嵌入式光学器件
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Application No.: US13445866Application Date: 2012-04-12
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Publication No.: US09403296B2Publication Date: 2016-08-02
- Inventor: Brian Dean Hachtmann , Mark Riegel , David Elias Hegeman , William Christopher Bishop , William Vucich Beecher
- Applicant: Brian Dean Hachtmann , Mark Riegel , David Elias Hegeman , William Christopher Bishop , William Vucich Beecher
- Applicant Address: US CA Palo Alto
- Assignee: TELSA MOTORS, INC.
- Current Assignee: TELSA MOTORS, INC.
- Current Assignee Address: US CA Palo Alto
- Agency: Garlick & Markison
- Agent Bruce E. Garlick
- Main IPC: H01M2/10
- IPC: H01M2/10 ; B32B3/24 ; B32B3/26 ; B29C35/08

Abstract:
An enhanced multiobject potting fixture for exposure to a curing modality that sets an adhesive includes a fixture housing supporting a plurality of objects, the fixture housing having a wall defining a plurality of bonding wells with each the bonding well receiving a first portion of one of the objects, each the bonding well including an aperture in the wall proximate the first portion wherein each bonding well includes a target zone for selective cure of the adhesive to inhibit the adhesive from exiting the aperture; and a fixture enhancement structure integrated into the wall concentrating the curing modality in each the target zone.
Public/Granted literature
- US20130270749A1 EMBEDDED OPTICS IN MODULAR ASSEMBLIES Public/Granted day:2013-10-17
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