Invention Grant
- Patent Title: Insulating plate, insulating plate manufacturing method and terminal block
- Patent Title (中): 绝缘板,绝缘板制造方法和接线端子
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Application No.: US13936511Application Date: 2013-07-08
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Publication No.: US09403306B2Publication Date: 2016-08-02
- Inventor: Daisuke Akuta
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP
- Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee Address: JP
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JP2011-010054 20110120
- Main IPC: B28B7/10
- IPC: B28B7/10 ; B29C45/14 ; H01R4/34 ; H01R43/18 ; F16B33/00 ; B29C45/40 ; C08K3/00 ; F16B37/04 ; H01R9/24

Abstract:
An insulating plate (20) made of synthetic resin for transferring heat transferred from conductors to nuts (10) to a heat sink (40) is provided with nut accommodating recesses (21) for accommodating the nuts (10). Each nut accommodating recess (21) includes a bottom plate (22) to be sandwiched between the nuts (10) and the heat sink (40) and a surrounding wall (23) vertically extending from the bottom plate (22) to surround the side surface of the nut (10). The surrounding walls (23) are provided with first and second pressing surfaces (28, 29) to be pressed by ejector pins (83).
Public/Granted literature
- US20130292876A1 INSULATING PLATE, INSULATING PLATE MANUFACTURING METHOD AND TERMINAL BLOCK Public/Granted day:2013-11-07
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