Invention Grant
- Patent Title: Pattern forming method and pattern forming apparatus
- Patent Title (中): 图案形成方法和图案形成装置
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Application No.: US14311404Application Date: 2014-06-23
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Publication No.: US09403316B2Publication Date: 2016-08-02
- Inventor: Ikuo Yoneda
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
- Main IPC: B29C59/02
- IPC: B29C59/02 ; B82Y10/00 ; B82Y40/00 ; G03F7/00 ; B29C59/00 ; B29L31/34
Abstract:
According to an aspect of the present invention, there is provided a pattern forming apparatus in which a mold having a pattern is brought into contact with an imprinting material on a substrate to transfer the pattern, the apparatus including: a holding part configured to hold the mold; a moving part configured to move the holding part so that the mold is brought into contact with the imprinting material on the substrate and that the mold is removed therefrom; and a control part configured to control so that at least one of conditions of removing the mold can be changed based on conditions of the pattern formed in the mold, the conditions including a rate and an angle of removing the mold.
Public/Granted literature
- US20140300018A1 PATTERN FORMING METHOD AND PATTERN FORMING APPARATUS Public/Granted day:2014-10-09
Information query
