A bonding method includes vacuum bagging a second metal plate atop a first metal plate, with a thermosetting adhesive in a lap joint therebetween covered in turn by a porous peel ply and a porous breather ply; the plates being initially clamped together by applying vacuum through the breather ply; and thermally curing the adhesive, with the breather and peel plies being preselected to capture adhesive seepage from the lap joint and removed with the plies to correspondingly reduce cured adhesive flash.