Invention Grant
US09403674B2 Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using through mold vias (TMVs)
有权
用于通过模具通孔（TMV）封装微机电系统（MEMS）晶片和专用集成电路（ASIC）模具的方法，
- Patent Title: Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using through mold vias (TMVs)
- Patent Title (中): 用于通过模具通孔（TMV）封装微机电系统（MEMS）晶片和专用集成电路（ASIC）模具的方法，
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Application No.: US14457160Application Date: 2014-08-12
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Publication No.: US09403674B2Publication Date: 2016-08-02
- Inventor: Chun-Wen Cheng , Hung-Chia Tsai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00
Abstract:
A method for packaging a microelectromechanical system (MEMS) device with an integrated circuit die using through mold vias (TMVs) is provided. According to the method, a MEMS substrate having a MEMS device is provided. A cap substrate is secured to a top surface of the MEMS substrate. The cap substrate includes a recess corresponding to the MEMS device in a bottom surface of the cap substrate. An integrated circuit die is secured to a top surface of the cap substrate over the recess. A housing covering the MEMS substrate, the cap substrate, and the integrated circuit die is formed. A through mold via (TMV) electrically coupled with the integrated circuit die and extending between a top surface of the housing and the integrated circuit die is formed. The structure resulting from application of the method is also provided.
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