Invention Grant
- Patent Title: Photosensitive resin composition and photosensitive film using same
- Patent Title (中): 感光树脂组合物和使用其的感光膜
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Application No.: US14651081Application Date: 2013-12-05
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Publication No.: US09403977B2Publication Date: 2016-08-02
- Inventor: Satoko Ueda , Ken Sawabe
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: JP2012-271369 20121212
- International Application: PCT/JP2013/082703 WO 20131205
- International Announcement: WO2014/091997 WO 20140619
- Main IPC: C08F2/46
- IPC: C08F2/46 ; C08F2/50 ; B29C71/04 ; C08G61/04 ; C08L63/04 ; C08J5/18 ; G03F7/022 ; G03F7/023 ; G03F7/004

Abstract:
The present invention relates to a positive-type photosensitive resin composition comprising (A) a modified novolac-type phenol resin having an unsaturated hydrocarbon group, (B) a novolac-type phenol resin obtained from metacresol and paracresol, (C) a novolac-type phenol resin obtained from orthocresol, (D) a compound generating an acid by light, and (E) a polybasic acid or a polybasic acid anhydride, wherein the content of the (E) component is lower than 40 parts by mass per 100 parts by mass of the total amount of the (A) component, the (B) component, the (C) component and the (D) component.
Public/Granted literature
- US20150315379A1 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE FILM USING SAME Public/Granted day:2015-11-05
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