Invention Grant
- Patent Title: Resin composition and resin molded article
- Patent Title (中): 树脂组合物和树脂模制品
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Application No.: US14627468Application Date: 2015-02-20
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Publication No.: US09403979B2Publication Date: 2016-08-02
- Inventor: Akira Imada
- Applicant: FUJI XEROX CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJI XEROX CO., LTD.
- Current Assignee: FUJI XEROX CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2014-145283 20140715
- Main IPC: C08L69/00
- IPC: C08L69/00 ; C08L33/14 ; C08L67/00
Abstract:
A resin composition includes a polycarbonate resin, an aromatic polyester resin, a glycidyl group-containing polyethylene copolymer, and red phosphorus of which particle surfaces are covered with at least one of a thermosetting resin and an inorganic substance, and a volume average particle diameter is 15 μm or less.
Public/Granted literature
- US20160017142A1 RESIN COMPOSITION AND RESIN MOLDED ARTICLE Public/Granted day:2016-01-21
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