Invention Grant
- Patent Title: Substrate position detecting apparatus, substrate processing apparatus using substrate position detecting apparatus, and deposition apparatus
- Patent Title (中): 基板位置检测装置，使用基板位置检测装置的基板处理装置和沉积装置
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Application No.: US14104049Application Date: 2013-12-12
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Publication No.: US09404184B2Publication Date: 2016-08-02
- Inventor: Katsuyoshi Aikawa
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2012-279911 20121221
- Main IPC: C23C16/52
- IPC: C23C16/52 ; C23C16/44 ; C23C16/455 ; H01L21/67 ; H01L21/68 ; H01L21/687 ; G01N21/15 ; G01N21/95
Abstract:
A substrate position detecting apparatus detects a position of a substrate inside a chamber from an image of a target inside the chamber. The apparatus includes an image pickup device to pick up the image of the target inside the chamber through a window, an illumination device to irradiate light upwards, an illumination reflecting plate provided above the illumination device and including a reflecting surface to reflect the light from the illumination device towards the window, and a reflection restricting part provided on the reflecting surface to form a shadow in a predetermined region that includes the target inside the chamber.
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