Invention Grant
- Patent Title: Method for validating measurement data
- Patent Title (中): 验证测量数据的方法
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Application No.: US13666140Application Date: 2012-11-01
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Publication No.: US09404743B2Publication Date: 2016-08-02
- Inventor: Chui-Jung Chiu , Jen-Chieh Lo , Ying-Chou Cheng , Ru-Gun Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G06F17/50 ; G01B9/00 ; G06K9/00 ; G01B15/00

Abstract:
A method is provided for validating measurement data, such as data obtained from a scanning electron microscope using in a semiconductor fabrication facility. The method includes applying a signal on a material feature by using a source in a measurement tool having a tool setting parameter, collecting a response signal from the material feature by using a detector in the measurement tool to obtain the measurement data, calculating a simulated response signal by a smart, and validating the measurement data by comparing the collected response signal with the simulated response signal. The system also includes a design database having a design feature, a measurement tool collecting a response signal, and a smart review engine configured to connect the measurement tool and the design database. The smart engine generates a simulated response signal using the design feature and a measurement tool setting parameter so that the measurement is validated by comparing a collected response signal and a simulated response signal.
Public/Granted literature
- US20140121799A1 METHOD FOR VALIDATING MEASUREMENT DATA Public/Granted day:2014-05-01
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