Invention Grant
- Patent Title: Method of manufacturing transparent conductive film
- Patent Title (中): 透明导电膜的制造方法
-
Application No.: US14041549Application Date: 2013-09-30
-
Publication No.: US09406415B2Publication Date: 2016-08-02
- Inventor: Mari Tanabe , Hidehiko Andou , Hideo Sugawara
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2011-182733 20110824
- Main IPC: C30B33/00
- IPC: C30B33/00 ; H01B13/00 ; G06F3/041

Abstract:
A method of manufacturing a transparent conductive film has the steps of: preparing a laminated body in which a transparent conductive layer that is not patterned is formed on a flexible transparent base, removing a part of the transparent conductive layer to form the pattern forming part having the transparent conductive layer on the flexible transparent base and the pattern opening part not having the transparent conductive layer on the flexible transparent base, and heating the laminated body in which the transparent conductive layer is patterned. The absolute value of the difference H1−H2 of the dimensional change rate H1 of the pattern forming part and the dimensional change rate H2 of the pattern opening part in the heat treatment step is preferably less than 0.03%.
Public/Granted literature
- US20140027405A1 METHOD OF MANUFACTURING TRANSPARENT CONDUCTIVE FILM Public/Granted day:2014-01-30
Information query