Invention Grant
- Patent Title: Semiconductor wafer structure
- Patent Title (中): 半导体晶圆结构
-
Application No.: US14178814Application Date: 2014-02-12
-
Publication No.: US09406499B2Publication Date: 2016-08-02
- Inventor: Chen-Chun Chen , Chiu-Jung Chen , Fu-Tsun Tsai , Shiu-Ko Jangjian , Chi-Cherng Jeng , Hsin-Chi Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agent Chun-Ming Shih
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L21/02 ; H01L27/146
Abstract:
A semiconductor structure includes a wafer including a first surface and a periphery, a plurality of protrusions protruded from the first surface and a plurality of recesses spaced from each other by the plurality of protrusions, and each of the plurality of recesses is extended from the periphery of the wafer and is elongated across the first surface of the wafer.
Public/Granted literature
- US20150228720A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-08-13
Information query
IPC分类:
