Provided is a method for forming a pattern on a layer on a substrate. The method includes forming a line-and-space pattern on the layer; coating a resist on the line-and-space pattern and filling the resist in a space portion of the line-and-space pattern; exposing a pattern to the resist, developing the exposed resist, and forming a resist pattern on the space portion; and forming a pattern on the layer using a pattern which is a combination of a line portion of the line-and-space pattern and the resist pattern as a mask.