Invention Grant
- Patent Title: Retention device and retention method
- Patent Title (中): 保留装置和保留方法
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Application No.: US14125537Application Date: 2012-05-25
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Publication No.: US09406542B2Publication Date: 2016-08-02
- Inventor: Atsushi Miyanari
- Applicant: Atsushi Miyanari
- Applicant Address: JP Kawasaki-Shi
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2011-133261 20110615
- International Application: PCT/JP2012/063561 WO 20120525
- International Announcement: WO2012/172957 WO 20121220
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H01L21/02
Abstract:
A holding device including a first sucking section for sucking a wafer (substrate) from a side on which a dicing tape (supporting film) is adhered; a structure that supports a dicing frame (frame part) and covers a first region which (i) is on a surface of the dicing tape to which surface the wafer is not adhered and (ii) is between the wafer and the dicing frame; and a second sucking section for sealing a boundary between the structure and at least one of the dicing frame and the first region.
Public/Granted literature
- US20140109941A1 RETENTION DEVICE AND RETENTION METHOD Public/Granted day:2014-04-24
Information query
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