Invention Grant
- Patent Title: Diffusion barrier layer formation
- Patent Title (中): 扩散阻挡层形成
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Application No.: US14501137Application Date: 2014-09-30
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Publication No.: US09406554B2Publication Date: 2016-08-02
- Inventor: Brett H. Engel , Domingo A. Ferrer , Arun Vijayakumar , Keith Kwong Hon Wong
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Steven J. Meyers
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/285

Abstract:
A method of forming a titanium nitride (TiN) diffusion barrier includes exposing a deposition surface to a first pulse of a titanium-containing precursor and to a first pulse of a nitrogen-rich plasma to form a first TiN layer with a first nitrogen concentration making a lower portion of the TiN diffusion barrier, the first nitrogen concentration of the first TiN layer is increased by the first pulse of the nitrogen-rich plasma reducing a reactivity of the lower portion of the TiN diffusion barrier to prevent fluorine diffusion. The first TiN layer is exposed to second pulses of the titanium-containing precursor and the nitrogen-rich plasma to form a second TiN layer with a second nitrogen concentration above the first TiN layer making an upper portion of the TiN diffusion barrier, the first pulse of the nitrogen-rich plasma has a substantially longer duration than the second pulse of the nitrogen-rich plasma.
Public/Granted literature
- US20160093526A1 DIFFUSION BARRIER LAYER FORMATION Public/Granted day:2016-03-31
Information query
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