Invention Grant
- Patent Title: Liquid-cooled-type cooling device
- Patent Title (中): 液冷式冷却装置
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Application No.: US12546423Application Date: 2009-08-24
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Publication No.: US09406585B2Publication Date: 2016-08-02
- Inventor: Shogo Mori , Hideyasu Obara , Taizo Kuribayashi , Shinobu Tamura
- Applicant: Shogo Mori , Hideyasu Obara , Taizo Kuribayashi , Shinobu Tamura
- Applicant Address: JP Kariya-shi JP Tokyo
- Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI,SHOWA DENKO K.K.
- Current Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI,SHOWA DENKO K.K.
- Current Assignee Address: JP Kariya-shi JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-216614 20080826
- Main IPC: F28F3/12
- IPC: F28F3/12 ; H01L23/473 ; H01L21/48 ; F28F3/02

Abstract:
A liquid-cooled-type cooling device includes a casing which has a cooling-liquid inlet formed at a rear end portion of the casing and a cooling-liquid outlet formed at a front end portion of the casing. A corrugated fin for forming a plurality of flow channels through which a cooling liquid flows from the rear side toward the front side is disposed within the casing to be located between the cooling-liquid inlet and the cooling-liquid outlet. A heat-generating-body mounting region is provided on an outer surface of a top wall of the casing. Projections which come into contact with front and rear end portions of the corrugated fin to thereby position the corrugated fin in the front-rear direction are provided on an inner surface of the bottom wall of the casing at positions shifted, in the left-right direction, from an inner surface region corresponding to the heat-generating-body mounting region.
Public/Granted literature
- US20100051235A1 LIQUID-COOLED-TYPE COOLING DEVICE Public/Granted day:2010-03-04
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