Invention Grant
- Patent Title: Lead frame, electric power converting device, semiconductor apparatus and method of manufacturing semiconductor apparatus
- Patent Title (中): 引线框架,电力转换装置,半导体装置及制造半导体装置的方法
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Application No.: US14314485Application Date: 2014-06-25
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Publication No.: US09406593B2Publication Date: 2016-08-02
- Inventor: Takuya Kadoguchi , Takahiro Hirano , Arata Harada , Masayoshi Nishihata , Tomomi Okumura
- Applicant: Takuya Kadoguchi , Takahiro Hirano , Arata Harada , Masayoshi Nishihata , Tomomi Okumura
- Applicant Address: JP Toyota-shi, Aichi-ken JP Kariya-shi, Aichi-ken
- Assignee: Toyota Jidosha Kabushiki Kaisha,Denso Corporation
- Current Assignee: Toyota Jidosha Kabushiki Kaisha,Denso Corporation
- Current Assignee Address: JP Toyota-shi, Aichi-ken JP Kariya-shi, Aichi-ken
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2013-156787 20130729
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00

Abstract:
According to the disclosure, a lead frame is provided, which includes: a first island and a second island that are arranged side by side; an outer peripheral frame; first leads that extend in a second direction perpendicular to the first direction; second leads that extend in the second direction; a first coupling portion that couples the first leads to the frame; a second coupling portion that couples the second leads to the frame; an intermediate portion formed between the first and second coupling portions in the first direction such that it extends in the second direction to terminate before the space between the first and second islands; and a deformation restraining portion formed or provided in at least one of the first leads, the second leads, the first and the second coupling portions and configured to restrain deformations of the first and second leads during a molding process.
Public/Granted literature
Information query
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