Invention Grant
- Patent Title: Molding compound structure
- Patent Title (中): 成型复合结构
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Application No.: US13773068Application Date: 2013-02-21
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Publication No.: US09406596B2Publication Date: 2016-08-02
- Inventor: Hsien-Wei Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/498 ; H01L23/00 ; H01L23/31 ; H01L23/38 ; H01L21/48 ; H01L25/065 ; H01L25/10
Abstract:
A device comprises a package component comprising a plurality of bumps formed on a first side of the package component, a semiconductor die mounted on the first side of the package component, a dielectric material formed over the first side of the package component, wherein four corners of the top surface of the package component are free from the dielectric material and a top package bonded on the first side of the package component, wherein the semiconductor die is located between the top package and the package component.
Public/Granted literature
- US20140231984A1 Molding Compound Structure Public/Granted day:2014-08-21
Information query
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