Invention Grant
- Patent Title: Printed circuit board and stacked semiconductor device
- Patent Title (中): 印刷电路板和堆叠半导体器件
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Application No.: US14593346Application Date: 2015-01-09
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Publication No.: US09406600B2Publication Date: 2016-08-02
- Inventor: Hiroyuki Kudo
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2014-008422 20140121
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/02 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/498
Abstract:
A semiconductor package includes an interposer and a semiconductor element mounted on one surface of the interposer. A plurality of lands are formed on another surface of the interposer. A plurality of lands are formed on a surface of a printed wiring board opposed to the another surface of the interposer. The plurality of lands on the printed wiring board are divided into a first land group including lands connected to the plurality of lands formed on the another surface of the interposer via solder and a second land group including lands connected to an insulating member of the interposer via solder. The second land group is provided in a region opposed to a center region of the another surface of the interposer. The first land group is provided around the second land group so as to surround the second land group.
Public/Granted literature
- US20150206832A1 PRINTED CIRCUIT BOARD AND STACKED SEMICONDUCTOR DEVICE Public/Granted day:2015-07-23
Information query
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