Invention Grant
- Patent Title: Integrated circuit with guard ring
- Patent Title (中): 集成电路带保护环
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Application No.: US14515306Application Date: 2014-10-15
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Publication No.: US09406605B2Publication Date: 2016-08-02
- Inventor: Hsien-Yuan Liao , Shyh-An Chi
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/522 ; H01L23/64 ; H01L23/00 ; H01L23/58 ; H01L49/02

Abstract:
An integrated circuit includes a circuit and a guard ring. The circuit is over a substrate. The guard ring surrounds the circuit and includes a staggered line. The staggered line comprises a first zigzag line and a second zigzag line. The first zigzag line comprises interconnections formed in at least two GDS layers. The second zigzag line comprises interconnections formed in at least two GDS layers. The first zigzag line and the second zigzag line form a first quadrangle and a second quadrangle.
Public/Granted literature
- US20150364421A1 INTEGRATED CIRCUIT WITH GUARD RING Public/Granted day:2015-12-17
Information query
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