Invention Grant
- Patent Title: Electronic circuit and semiconductor component
- Patent Title (中): 电子电路和半导体元件
-
Application No.: US13951894Application Date: 2013-07-26
-
Publication No.: US09406622B2Publication Date: 2016-08-02
- Inventor: Tadahiro Sasaki , Kazuhiko Itaya , Hiroshi Yamada
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P
- Priority: JP2012-167662 20120727
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01L23/552 ; H01L25/065 ; H01L23/00
Abstract:
A circuit board according to an embodiment is one in which a plurality of electronic components is mounted on a printed wiring board. The circuit board includes a semiconductor component that is mounted on the printed wiring board, and the semiconductor component includes a semiconductor device and a first EBG structure formed on or above the semiconductor device. An operating frequency of the semiconductor device exists outside a cutoff band of the first EBG structure, and the first EBG structure is connected to a ground or a power supply of the printed wiring board.
Public/Granted literature
- US20140029227A1 ELECTRONIC CIRCUIT AND SEMICONDUCTOR COMPONENT Public/Granted day:2014-01-30
Information query
