Invention Grant
- Patent Title: Electromagnetic shield and associated methods
- Patent Title (中): 电磁屏蔽及相关方法
-
Application No.: US14507573Application Date: 2014-10-06
-
Publication No.: US09406623B2Publication Date: 2016-08-02
- Inventor: Vladimir Mikhalev , Michael Smith , Henry J. Fulford , Puneet Sharma , Zia A. Shafi
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/522 ; H01L27/088 ; H01L29/40 ; H01L29/45 ; H03K17/16
Abstract:
Semiconductor devices are described, along with methods and systems that include them. One such device includes a diffusion region in a semiconductor material, a terminal coupled to the diffusion region, and a field plate coupled to the terminal and extending from the terminal over the diffusion region to shield the diffusion region. Additional embodiments are also described.
Public/Granted literature
- US20150021707A1 ELECTROMAGNETIC SHIELD AND ASSOCIATED METHODS Public/Granted day:2015-01-22
Information query
IPC分类:
