Invention Grant
- Patent Title: Semiconductor module and power converter
- Patent Title (中): 半导体模块和电源转换器
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Application No.: US14825922Application Date: 2015-08-13
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Publication No.: US09406624B2Publication Date: 2016-08-02
- Inventor: Rei Yoneyama , Akira Goto
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2014-241915 20141128
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/31
Abstract:
A semiconductor module includes a case, a semiconductor component provided in the case for switching a current, encapsulating resin provided in the case for covering the semiconductor component, a magnetic shield contacting the encapsulating resin and containing a magnetic material, and an embedded magnetic shield embedded in the case, the embedded magnetic shield containing a magnetic material.
Public/Granted literature
- US20160155706A1 SEMICONDUCTOR MODULE AND POWER CONVERTER Public/Granted day:2016-06-02
Information query
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