Invention Grant
- Patent Title: Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
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Application No.: US14571049Application Date: 2014-12-15
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Publication No.: US09406637B2Publication Date: 2016-08-02
- Inventor: Shinji Wakisaka , Takeshi Wakabayashi
- Applicant: TERA PROBE, INC.
- Applicant Address: JP Kagawa
- Assignee: AOI ELECTRONICS CO., LTD.
- Current Assignee: AOI ELECTRONICS CO., LTD.
- Current Assignee Address: JP Kagawa
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2009-158618 20090703; JP2009-158622 20090703; JP2009-158629 20090703
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/552 ; H01L23/00 ; H01L21/56 ; H01L21/683 ; H01L23/538 ; H01L23/28 ; H01L23/50 ; H01L23/31 ; H01L23/498 ; H01L23/525
Abstract:
A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least one of the remaining of the connection pads are connected to a wiring. The construct also includes a first columnar electrode provided to be connected to the common wiring and a second columnar electrode provided to be connected to a connection pad portion of the wiring.
Public/Granted literature
Information query
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