Invention Grant
- Patent Title: Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof
- Patent Title (中): 复合载板结构的倒装芯片级封装及其制造方法
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Application No.: US13938335Application Date: 2013-07-10
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Publication No.: US09406641B2Publication Date: 2016-08-02
- Inventor: Ting-Hao Lin , Yi-Fan Kao , Shuo-Hsun Chang , Yu-Te Lu , Kuo-Chun Huang
- Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
- Applicant Address: TW Taoyuan County
- Assignee: Kinsus Interconnect Technology Corp.
- Current Assignee: Kinsus Interconnect Technology Corp.
- Current Assignee Address: TW Taoyuan County
- Agency: Rosenberg, Klein & Lee
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H05K3/46 ; H01L23/498 ; H05K1/02 ; H05K1/18 ; H01L25/10
Abstract:
A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate having a flip region with a through-opening and bonding to a Non-conductive Film to bond to a carrier board in order to form a compound carrier board structure. The baseplate is constructed with a low Thermal Expansion Coefficient material.
Public/Granted literature
- US20150014031A1 COMPOUND CARRIER BOARD STRUCTURE OF FLIP-CHIP CHIP-SCALE PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-01-15
Information query
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