A semiconductor device includes a device die, a first power supply die, and a second power supply die different from the first power supply die. The device die includes a first circuit and a second circuit. The first power supply die is electrically coupled to the first circuit and configured to supply power for the first circuit. The second power supply die is electrically coupled to the second circuit and configured to supply power for the second circuit. The first and second power supply dies are attached to the device die, and overlap the device die in a thickness direction of the device die.