Invention Grant
- Patent Title: Methods of packaging semiconductor devices and packaged semiconductor devices
- Patent Title (中): 封装半导体器件和封装半导体器件的方法
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Application No.: US14257833Application Date: 2014-04-21
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Publication No.: US09406650B2Publication Date: 2016-08-02
- Inventor: Shin-Puu Jeng , Wen-Chih Chiou , Tu-Hao Yu , Hung-Jung Tu , Yu-Liang Lin , Shih-Hui Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L25/065 ; H01L25/00 ; H01L21/56 ; H01L23/31 ; H01L23/00
Abstract:
Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging semiconductor devices includes coupling integrated circuit dies to a substrate, and disposing a molding material around the integrated circuit dies. A cap layer is disposed over the molding material and the plurality of integrated circuit dies.
Public/Granted literature
- US20150221611A1 Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices Public/Granted day:2015-08-06
Information query
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