Invention Grant
US09406660B2 Stacked semiconductor die assemblies with die support members and associated systems and methods
有权
具有管芯支撑构件和相关系统和方法的堆叠式半导体管芯组件
- Patent Title: Stacked semiconductor die assemblies with die support members and associated systems and methods
- Patent Title (中): 具有管芯支撑构件和相关系统和方法的堆叠式半导体管芯组件
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Application No.: US14264699Application Date: 2014-04-29
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Publication No.: US09406660B2Publication Date: 2016-08-02
- Inventor: Seng Kim Ye , Hong Wan Ng
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/70 ; H01L23/34 ; H01L23/52 ; H01L25/18 ; H01L25/065 ; H01L23/00 ; H01L25/00 ; H01L23/31
Abstract:
Stacked semiconductor die assemblies with die support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a support member attached to the package substrate. The support member can be separated from the first semiconductor die, and a second semiconductor die can have one region coupled to the support member and another region coupled to the first semiconductor die.
Public/Granted literature
- US20150311186A1 STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND ASSOCIATED SYSTEMS AND METHODS Public/Granted day:2015-10-29
Information query
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